Power Electronics Forum at electronica

November 13-16, 2018 @ Hall A6 - Stand 158a

The Power Electronics Forum at electronica in Hall A6, Stand 158, is a theater-style presentation area with free access for all electronica visitors.

Aspencore is staging a 4-day forum program consisting of panel discussions and presentation slots for technical papers about innovative applications and technologies, trends and new product offerings covering the whole range of Power Electronics Components, Power Supplies and Batteries.

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Amongst others, major trends like Wide Band Gap Semiconductors, Renewable Energies, Smart Grid and Energy Storage will be covered by the Power Electronics Forum at electronica.


Conference Program

Time Tuesday Wednesday Thursday Friday
11:00 Special Report: Energy generation and storage in the Smart Grid
Aspencore Media
Special Report: Powering the next generation of automotive systems
Aspencore Media
Special Report: The state of industrial power
Aspencore Media
11:30 Advanced Modular DC/DC Regulators in High-Density Systems
Analog Devices
Mind of The Engineer
Aspencore Media
Mind of The Engineer
Aspencore Media
12:00 WeEnBridge – an efficient bipolar rectifier bridge alternative
WeEn
China´s trend in Power Market
Aspencore
PSMA Committee Reports on Power Supply Roadmap and 3D Packaging
PSMA
12:30 Measurement based Modeling and Simulation of DC-DC converters
Omicron electronics GmbH
13:00 Special Report: The state of industrial power
Aspencore Media
Perfect combination for MHz wireless power CoolGaN™ and 1/2EDN @6.78 MHz
Infineon
13:30 Grid Integration of Renewable Power and Storage Systems with New Efficient and Highly Compact SiC Inverters
Fraunhofer IEE
Get the most out of your power module with Heraeus Die Top System (DTS®)
Heraeus
Ferrite Material development for WBG semiconductors
Bs&T Frankfurt am Main
14:00 New Gate Driver ICs with excellent Ground Shift robustness
Infineon
Infineon CoolSiC™ - Revolution to rely on
Infineon
Accurately Quantifying Core Losses via Precision Power Analysis
ZES
14:30 Panel Discussion: Driving Industry 4.0
Aspencore
Gate Driver circuit optimization for SiC Power Devices
Rohm
The Emerging 48V Ecosystem
OnSemi
15:00 Panel Discussion: What will power the next generation of vehicles?
Aspencore
Panel Discussion: Growing the Smart Grid
Aspencore
15:30 High performance magnetic components for EV charging
Vacuumschmelze
16:00 Magnetizable concrete technology for wireless charging:  an industrial perspective
Magment
16:30 Practical Designs for USB PD + PPS Compliant Adapters
Power Integrations
Mind of The Engineer
Aspencore Media
17:00 A new era in power electronics with Infineon’s CoolGaN™
Infineon

Program Details

Time Lecture
13:00 Special Report: The state of industrial power
Alix Paultre, Aspencore Media
This special report and presentation will cover the current state of the art in industrial power systems. The report will cover core technologies, new materials, and new driver topologies and how they will address the needs of next-generation industrial systems.
13:30 Grid Integration of Renewable Power and Storage Systems with New Efficient and Highly Compact SiC Inverters
Dr.-Ing. Marco Jung, Fraunhofer IEE
14:00 New Gate Driver ICs with excellent Ground Shift robustness
Hubert Baierl, Infineon
In conventional low-side gate-driver ICs, high current transients may cause ground shift potential between the driver IC and controller IC, causing false triggering or failure of the gate-driver IC. Infineon Technologies is announcing a robust and small size solution to this common problem. This new driver IC features a true differential input, to isolate the input stage from common mode ground shifts and enhance switching speed as well as reliability in hard-switching applications, especially when using MOSFETS with kelvin source packages or in low-cost PCBs with long distance between the gate-driver IC and the control IC.
14:30 Panel Discussion: Driving Industry 4.0
Moderated by Aspencore
The marketplace is moving aggressively forward towards industry 4.0, the complete integration of automation and command and control in the factory environment. With everything in the building a complex logic-based system, what are the challenges facing the designers of the next-generation supplies powering them? What will be the role of the new materials, topologies, and processes in this new manufacturing environment? This panel will have professionals from wide-bandgap, software, and power supply manufacturers who will present their ideas on the future.
15:30 High performance magnetic components for EV charging
Frank Schnelle, Vacuumschmelze
This presentation will show how advanced magnetic components help to realize product safety, reliability and high performance for the evolving electric vehicle charging infrastructure. The focus will be on all relevant EV charging modes covering AC charging via IC-CPD or wall box (Modes 2 & 3), as well as DC fast charging (Mode 4) and Inductive charging. The technical requirements of each charging mode will be shown and briefly described.
16:00 Magnetizable concrete technology for wireless charging:  an industrial perspective
Mauricio Esguerra, Magment
EV inductive wireless is increasingly becoming a relevant charging infrastructure. The industrialization of the transmitter coil is a main challenge and is optimally addressed by magnetizable concrete casting. This technology allows competitive power transmission solutions with both high efficiency and robust road integration.
16:30 Practical Designs for USB PD + PPS Compliant Adapters
Doug Bailey, Power Integrations
In this session, we discuss the emerging need for USB PD 3.0 + PPS compliant designs and how to achieve them using practical examples with PPS certification. Precise battery charging relies on digitally controlled micro-stepping of output voltage levels, a new concept in power conversion that requires new switching and control techniques. Meticulous design is necessary to deliver standards-compliant power conversion. We will describe a technology approach that reduces design time and yields compact designs with low-component count, that are highly efficient and cost effective.
17:00 A new era in power electronics with Infineon’s CoolGaN™
Dr. Gerald Deboy, Infineon
The commercial availability of wide bandgap power semiconductors with their significantly better figures of merit raises some fundamental questions on the agenda of many manufacturers of power supplies: how much better are system solutions based on these wide bandgap components in terms of density and efficiency? To what extent can silicon based solutions follow at the potential expense of more complex topologies and control schemes? We investigate in detail the value proposition of GaN for server systems with 12 Vout in terms of increased output power in a given form factor pushing density as high as 80 W/in³ at an efficiency level significantly above Titanium standard. Vice versa for server systems with 48 Vout we analyze the path towards highest efficiency keeping power density at today’s level of 30 to 40 W/in³.
Time Lecture
11:00 Special Report: Energy generation and storage in the Smart Grid
Alix Paultre, Aspencore Media
This special report and presentation will examine the various generation technologies, both legacy and developing, and how they are migrating towards becoming the new Smart Grid infrastructure. The future will contain a mix of fossil- and green-based technologies, and proper planning and integration will maximize cost-effectiveness while minimizing waste and pollution. This report will provide a snapshot of this rapidly-moving industry.
11:30 Advanced Modular DC/DC Regulators in High-Density Systems
Chris Mann, Analog Devices
Analog Devices’ advanced 3D, fast-cooling packaging technology will soon introduce the 4th generation uModule regulators proving compact, feature-rich devices with 2x to 3x more power density designed for 2019-2021 data centers, autonomous vehicles, test equipment and super computers, to name a few. Capable of current sharing in uniformly distributed power blocks for easy cooling and elimination of hotspots, a uModule regulator solution can deliver 60A to 600A in a small space to sub-10 nm node very low voltage FPGAs, GPUs, Processors and ASICs. Sophisticated system energy saving, cheaper heat management, smaller and more economical infrastructures will be possible with these new uModule regulators. This presentation will review the history and explore the future of one of the most successful and advanced power management technologies: the uModule power products.
12:00 WeEnBridge – an efficient bipolar rectifier bridge alternative
Nick Koper, WeEn
The combination of bipolar technology and an innovative driving method enables the implementation of a cost-effective active mains rectifier bridge. With the new rectifier bridge the power dissipation in the rectification stage of a power converter can be reduced by 70% and the overall system efficiency is increased by 0.5% to 1.0%. In power converters that operate 24/7, the active bridge pays for itself within one year.
12:30 Measurement based Modeling and Simulation of DC-DC converters
Steve Sandler, Omicron electronics GmbH
Modern systems, particularly automotive and portable applications, include dozens of DC-DC converters within a single device.    The DC-DC converter is a significant contributor to the cost and the performance of these systems.  Maximizing the system performance and minimizing cost is therefore an essential task for today’s designers.
13:00 Perfect combination for MHz wireless power CoolGaN™ and 1/2EDN @6.78 MHz
Stephan Schächer, Infineon
Creating system solution for 6.78 MHz Resonant Wireless Power that can efficiently charge multiple devices and make use of the technologies spatial freedom is a challenge. Especially in the popular Class E architecture with its sinusoidal characteristics but resulting higher peak voltages Infineon CoolGaN™ gives the designer the perfect tool to implement above targets. This is supported by Infineon’s Gate Drivers and proven with measurements, how these solutions can open up new power levels for wireless charging whilst keeping its flexibility.
13:30 Get the most out of your power module with Heraeus Die Top System (DTS®)
Dr. Christophe Fery, Heraeus
Combining state-space average techniques with transient or Harmonic Balance simulation elements, the model provides AC, DC, time domain and spectral content in a single, fast-simulating model.  In this presentation I’ll show the relationship between the DC-DC converter performance characteristics and the related model parameters, as well as how to determine the model parameters from a few simple measurements. The simulated and measured results will be compared for several examples, confirming the highly accurate results achieved from the measurement based model.
14:00 Infineon CoolSiC™ - Revolution to rely on
Dr. Peter Friedrichs, Infineon
SiC power devices enter more and more applications today. A couple of factors supports this process. Maturity levels and cost/performance of diodes and transistors are interesting enough for many users to consider the new components. Furthermore, devices are more and more fine-tuned to target application requirements, which make it easier to enter the most promising target applications. For the wide use of new wide band gap transistors, however, beside performance it is essential to fulfill further system requirements like outstanding reliability or easy to use aspects. The contribution will show in the example of Infineon’s recent CoolSiC™ MOSFET technology how those often conflicting targets can be merged in a product which is ready to be used in very high volume e.g. in modern solar inverters or fast charging infrastructure.
14:30 Gate Driver circuit optimization for SiC Power Devices
Walter Balzarotti, Rohm
A correct driving of SiC power devices and a tailored optimization of the gate driver circuit is mandatory in order to reach the performances and reliability level requested by those systems that make use of SiC technology. The adoption of such high performances devices has its own challenges. This is an introduction to the analysis of the switching characteristics of SiC devices and how to improve their functionality to develop a reliable and effective SiC-based power system.
15:00 Panel Discussion: What will power the next generation of vehicles?
Moderated by Aspencore
There is a passionate debate going on in the consumer marketplace on the drivetrain in the next generation of passenger vehicles. This sometimes-acrimonious debate puts a downward pressure on electric vehicle (EV) development, as financing and managerial focus is often tied to public impressions. But what is the engineering debate on this? Will there be a “tipping point’ for EVs, and when will it occur? What are the factors involved? Our industry panel will discuss both the core technologies and their related infrastructures.
16:00
16:30 Mind of The Engineer
Rich Quinnell, Editor, Aspencore Media
Aspencore regularly surveys its worldwide engineering audience, seeking to understand “The Mind of the Engineer.” Questions cover work conditions, job satisfaction, information-gathering methods, and a host of other details to gain insights into how design engineering is being practiced across the globe, and exploring the regional and generational variations. Aspencore Special Projects Editor Rich Quinnell will be presenting the highlights of the 2018 survey results in a 20-minute session open to all Electronica attendees.
17:00
Time Lecture
11:00 Special Report: Powering the next generation of automotive systems
Alix Paultre, Aspencore Media
While there is a debate on the future of the fossil-fuel car, the future of electric vehicles, two-, three-, and four-wheeled, is already established. Even in a world where fueled vehicles of some type survive, it goes without saying that they will still have the rest of the new generation of functionality like self-driving and advanced infotainment. This report and presentation will look at the state of the vehicle power systems today, and where it is going in the foreseeable future. From the grid to the drivetraind, the latest generation of vehicles create many challenges (and opportunities) for the power electronics designer.
11:30 Mind of The Engineer
Rich Quinnell, Editor, Aspencore Media
Aspencore regularly surveys its worldwide engineering audience, seeking to understand “The Mind of the Engineer.” Questions cover work conditions, job satisfaction, information-gathering methods, and a host of other details to gain insights into how design engineering is being practiced across the globe, and exploring the regional and generational variations. Aspencore Special Projects Editor Rich Quinnell will be presenting the highlights of the 2018 survey results in a 20-minute session open to all Electronica attendees.
12:00 China´s trend in Power Market
Yorbe Zhang, Aspencore
This speech will give an overview of China’s power Industry. What will be the power industry growth trend? What will be products and applications which dominate the China market in the future? Will also cover major power products development trends, such as switching power and power modular, etc.
12:30
13:00
13:30 Ferrite Material development for WBG semiconductors
JC Sun, Bs&T Frankfurt am Main
Inherent interaction between the crystal composition and processing is the key to master the state of art polycrystalline material.
14:00 Accurately Quantifying Core Losses via Precision Power Analysis
Bernd Neuner, ZES
The introduction of wide-bandgap semiconductors like SiC and GaN allows electronics design engineers to break through efficiency barriers, yet it imposes new limits when it comes to reliable quantification of power losses in magnetic components. Precise, trustworthy measurements with sufficient flexibility to handle all types of DUTs over the necessary frequency spectrum are imposing enormous demands on data acquisition and processing.
14:30 The Emerging 48V Ecosystem
Ali Husain, Senior Manager, Strategic and Corporate Marketing, OnSemi
Several trends are driving the development of a 48V compatible ecosystem of devices in power electronics.  Increases in power density and system efficiency in applications as diverse as automobiles, robotics, and computing require new solutions at nominal 48V supply voltage.  This presentation will discuss the disparate, parallel trends pushing these applications toward 48V solutions and some of the resulting parts and topologies arising out of this shift.
15:00 Panel Discussion: Growing the Smart Grid
Moderated by Aspencore
There is a lot of talk about the benefits of the Smart Grid, but there is a long pathway of development and deployment ahead of us. What are the challenges and obstacles involved? How well can current technologies address them? What promising technologies are in development that could more effectively address these development and deployment issues? We will have people from the grid infrastructure and support community talking about these and other system-related issues.
16:00
16:30
17:00
Time Lecture
11:00 Special Report: The state of industrial power
Alix Paultre, Aspencore Media
This special report and presentation will cover the current state of the art in industrial power systems. The report will cover core technologies, new materials, and new driver topologies and how they will address the needs of next-generation industrial systems.
11:30 Mind of The Engineer
Rich Quinnell, Editor, Aspencore Media
Aspencore regularly surveys its worldwide engineering audience, seeking to understand “The Mind of the Engineer.” Questions cover work conditions, job satisfaction, information-gathering methods, and a host of other details to gain insights into how design engineering is being practiced across the globe, and exploring the regional and generational variations. Aspencore Special Projects Editor Rich Quinnell will be presenting the highlights of the 2018 survey results in a 20-minute session open to all Electronica attendees.
12:00 PSMA Committee Reports on Power Supply Roadmap and 3D Packaging
Greg Evans, PSMA
Both of these committees have published reports in the past 12 months, and Greg Evans of the PSMA will deliver presentations on both the most recent Roadmap Report as well as results from their recent 3D Packaging Reports. These reports are provided to members and sold to non-member companies.
12:30
13:00
13:30
14:00
14:30
15:00

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Where to find us?

Our Power Forum at electronica 2018 is located in hall A6 stand 158.


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AspenCore
Rauwagnerstr. 5
85560 Ebersberg
Germany

Mail: info@iccmedia.com
www.iccmedia.com